The principle behind enhanced sputtering is similar to the sputtering process. A low-voltage arc discharge in the centre of the chamber makes the plasma intensity several times greater and thus produces a much higher degree of ionisation.
1 Electron beam source
2 Argon
3 Reactive gas
4 Planar magnetron evaporation source (coating material)
5 Components
6 Low-voltage arc discharge
7 Auxiliary anode
8 Vacuum pump
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